Accurate etching endpoint detection (EPD) is essential for ensuring wafer uniformity in semiconductor and microfabrication processes. It is vital for achieving consistency and uniformity, preventing over-etching and under-etching, maintaining quality and process control, improving cost efficiency, enhancing device performance, boosting yield, and enabling customization and scaling.
Currently, a fully developed technology for directly measuring the uniformity of wafers in industrial processing does not exist. Therefore, an indirect method using impedance measurement has been utilized to detect any surface variations and non-uniformities of the wafer.
Our SpectroChip technology offers a groundbreaking approach to directly measure wafer uniformity by utilizing spectral performance and surface variations. This pioneering technique takes advantage of the ongoing development of the SpectroChip sensor array technologies.